High Power Green 1W LED Chip LED Light Components DC2.55V 350mA

DL-TOP3045W-1W.pdf

1W High Power Red Color LED

LED High Power LED Chip 1W, Green, DC2.55V input, 350mA output, Energy Saving Lamp, Star, Component Chip

Precautions for Use:

1. Over-current-proof

Customer must not use the device in reverse and should apply resistors for extra protection. Otherwise slight voltage shift may cause abnormal current change and burn out failure would happen.
2. Storage
①Do not open moisture proof bag before the products are ready to be used.
②Before opening the package, the LEDs should be kept at 30℃ or less and 90%RH or less.
③The LEDs should be used within a year.
④After opening the package, the LEDs should be kept at 30℃ or less and 70%RH or less.
⑤The LEDs should be used within 168 hours (7 days) after opening the package.

⑥If the moisture absorbent material (silicone gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions:
Pre-curing treatment: 60±5℃ for 24 hours.
3. Thermal Management

①Because HP60M LED is a high power dissipation device, special and sufficient consideration in thermal management design must be made to optimize the thermal performance.

②Heat sink design is implemented in the device for an additional thermal connection. Since the device is capable of SMT process, tin must be spread both heat sink and solder pads areas to dissipate the heat.

③A high thermal conductivity substrate, such as Aluminum or Copper plate etc, must be applied for external thermal management. It is strongly recommended that the outer heat sink or PCB dimension per LED can not be less than 25 x 25 x 1 (L x W x H) mm. The materials for outer heat sink can be FR4 on Aluminum, MCPCB, or FPC on Aluminum.

④Special thermal designs are also recommended to take in outer heat sink design, such as FR4 PCB on Aluminum with thermal vias or FPC on Aluminum with thermal conductive adhesive, etc.

⑤Sufficient thermal management must be conducted, or the die junction temperature will be over the limit under large electronic driving and LED lifetime will decrease critically.
4. Soldering Condition

①Soldering should not be done more than two times.

②While soldering, do not put stress on the LEDs during heating.

③After soldering, do not warp the circuit board.






5. Soldering Iron

①For prototype builds or small series production runs it is possible to place and solder the LED by hand.

②Dispensing thermal conductive glue or grease on the substrates and follow its curing spec. Press LED housing to closely connect LED and substrate.

③It is recommended to hand solder the leads with a solder tip temperature of 280°C for less than 3 seconds within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal.

④Be careful because the damage of the product is often started at the time of the hand solder.
6. Handling Indications

During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound.

Absolute Maximum Ratings at Ta=25℃

Notes:

1. Proper current derating must be observed to maintain junction temperature below the maximum.
2. LEDs are not designed to be driven in reserve bias.

Electrical Optical Characteristics at Ta=25℃

Notes:

1. 2θ1/2 is the off axis angle from lamp centerline where the luminous intensity is 1/2 of the peak value. 2. Forward Voltage measurement tolerance: ±0.1V

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