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SMD Size 4.8x3.6mm LED Light Components Round Subminiature Package high power infrared led Chip

DOUBLE LIGHT ELECTRONICS TECHNOLOGY CO.,LTD
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SMD Size 4.8x3.6mm LED Light Components Round Subminiature Package high power infrared led Chip

Brand Name : Double Light

Model Number : DL-PCB4836SIRC-2SIR60

Certification : ISO9001:2008,Rosh

Place of Origin : China

MOQ : 1000 PCS

Price : USD 0.1-0.13/PCS

Payment Terms : Telegraphic Transfer in Advance (Advance TT, T/T)

Supply Ability : 15,000,000pcs per Day

Delivery Time : 5-7 working days after received your payment

Packaging Details : Dimensions per Unit:0.28 × 0.2 × 0.13 Meters • Weight per Unit:3.5 Kilograms • Units per Export Carton:40000 • Export Carton Dimensions L/W/H: 0.45 × 0.28 × 0.27 Meters • Export Carton Weight:14.2 Kilograms

Product Name : Infrared LED Light Components

Power (mW) : 200

Emitted Color : Infrared LED

Chip Material : GaAlAs

Peak Emission Wavelength : 850nm

Forward Voltage @20ma : 1.0-1.4V

Viewing Angle : 60 Deg

Radiant Intensity : 15mW/sr

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SMD Size 4.8x3.6mm LED Light Components Round Subminiature Package high power infrared led Chip

Infrared LED Light Components

Features:

  1. Package in 12mm tape on 7" diameter reels.
  2. Compatible with automatic placement equipment.
  3. Compatible with infrared and vapor phase reflow solder process.
  4. High reliability.
  5. Low forward voltage.
  6. Mono-color type.
  7. The product itself will remain within RoHS compliant version.

Descriptions:

  1. The device is an infrared emitting diode in miniature 4836SMD package which is molded in water clear plastic.
  2. The device is much smaller than leaded components. Thus enable smaller board size. Higher packing density. Reduced storage space and finally smaller equipment to be obtained.
  3. The device is specially matched with photodiode, phototransistor and infrared receiver module.

Applications:

  1. PCB mounted infrared sensor.
  2. Infrared emitting for miniature light barrier.
  3. Floppy disk drive.
  4. Optoelectronic switch.
  5. Smoke detector.

Part No. Chip Material Lens Color Source Color
DL-PCB4836SIRC-2SIR60 GaAlAs White Diffused Infrared

Absolute Maximum Ratings at Ta=25℃

Parameters Symbol Max. Unit
Power Dissipation PD 200 mW

Peak Forward Current

(1/10 Duty Cycle, 0.1ms Pulse Width)

IFP 1.0 A
Continuous Forward Current IF 150 mA
Reverse Voltage VR 5 V
Operating Temperature Range Topr -40℃ to +80℃
Storage Temperature Range Tstg -40℃ to +85℃
Soldering Temperature Tsld 260℃ for 5 Seconds

Electrical Optical Characteristics at Ta=25℃

Parameters Symbol Min. Typ. Max. Unit Test Condition
Radiant Intensity (Note 1) * Ee 8 15 --- mW/sr IF=100mA
Viewing Angle (Note 2) * 2θ1/2 --- 60 --- Deg IF=100mA
Peak Emission Wavelength λp --- 850 --- nm IF=100mA
Spectral Bandwidth △λ --- 45 --- nm IF=100mA
Forward Voltage VF 1.40 1.45 1.85 V IF=100mA
Reverse Current IR --- --- 10 µA VR=5V

Notes:

  1. Luminous Radiant is measured with a light sensor and filter combination that approximates the CIE eye-response curve.
  2. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.

Infrared LED Light Components Package Dimension:

SMD Size 4.8x3.6mm LED Light Components Round Subminiature Package high power infrared led Chip


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